As part of our strategy to expand operations and achieve vertical integration within the semiconductor industry, Meridionale Impianti has invested in the development of a state-of-the-art burn-in test system for SiC (Silicon Carbide) and GaN (Gallium Nitride) technology.
Burn-in stress testing plays a critical role in ensuring the stability and reliability of electronic components. By subjecting devices to extreme operating conditions over an extended period, these tests simulate intensive, continuous usage, helping to identify potential defects before components enter mass production or mission-critical applications.
Our next-generation burn-in solution is designed specifically for high-power devices, catering to both semiconductor manufacturing and R&D in the automotive sector.
Our burn-in oven chamber is engineered to provide reliable, high-performance stress testing for power devices. Key features include:
To complement the burn-in chamber, our 12 high-voltage driver boards efficiently manage power and control up to 152 devices simultaneously. These drivers are designed for seamless integration and optimal performance:
By combining advanced automation, high-density testing capabilities, and precision engineering, Meridionale Impianti’s burn-in system sets a new benchmark in reliability and efficiency for the semiconductor industry. Whether for mass production or cutting-edge research, our innovative SiC and GaN testing solutions empower companies to enhance product quality, accelerate development, and maintain a competitive edge in an ever-evolving market.
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